News
eSIM Interoperability a Key Priority for Re-Elected Chair of Trusted Connectivity Alliance
September 2022 by Marc Jacob
Claus Dietze (Giesecke+Devrient Mobile Security) has been re-elected to serve a third term as Trusted Connectivity Alliance’s (TCA) Chair of the Board, as the organisation focuses on driving forward industry initiatives to promote eSIM interoperability and trust, helping support the growing range of IoT use cases. In addition, two rotating seat members, Cyril Caillaud (NXP Semiconductors) and Jean-Philippe Betoin (Kigen) were also re-elected.
Speaking about his re-election, Dietze said: “With cellular connectivity supporting the rapid expansion of the IoT ecosystem, eSIM adoption and awareness is building as consumers, enterprises and organisations realise the benefits of seamless and flexible connectivity, advanced security and end-to-end digitalisation.
The latest TCA member data shows that global adoption of eSIM technology continued to build in 2021 as uptake of eSIM functionality increased across consumer, enterprise and machine-to-machine (M2M) verticals, most notably automotive and IoT use cases. This was enabled by a well-established global infrastructure now utilised by all major Tier 1 and Tier 2 operators.
With eSIM adoption set to be supported by the acceleration of 5G network rollouts, TCA is also focused on optimising the ‘Recommended 5G SIM’ – which defines the technical capabilities that promote the highest levels of security, privacy, and functionality in 5G networks – to address new IoT, industrial, automotive and satellite use-cases. Addressing the rising demand for mobile private networks is another key consideration.
In addition, TCA continues to engage stakeholders on the broader issues shaping the connected ecosystem. This includes monitoring the impact of the ongoing global chip shortage, as well as exploring initiatives to promote and increase sustainability.
Alongside Dietze, Caillaud and Betoin, the 2022/23 TCA Board consists of: Benoît Collier (IDEMIA), Christian Vignes (STMicroelectronics), Stephane Quetglas (Thales) and Bertrand Moussel (Valid).
