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KSW Microtec focuses on secure ID for eGovernment at Cards Asia 2011

April 2011 by Marc Jacob

KSW Microtec AG will demonstrate the pervasiveness of RFID solutions as a key to security and growth in identity solutions for the Asian market at Cards Asia in Singapore on April 13 to 15, 2011.

A highlight of KSW¹s presence at the show will be a conference presentation
on April 14 on the company¹s new revolutionary generation of prelaminates,
Thinlam®, with its proven advantages for eGovernment applications - and
introduced for the first time to the Asia Pacific region. As KSW
consistently launches unique products with optimum security and performance
features to the market, while maintaining a level of sustainable development
to meet future market trends, conference delegates and show visitors will
benefit from the company¹s expert knowledge and practical experience in the
growing eGovernment sector.

Thinlam® has already seen successful and increasing applications by card
manufacturers for high-security ID projects in the European and US markets
and KSW believes the Asian market is now ripe for its adoption. The Thinlam®
prelaminate family, along with other innovations, will be presented to the
Asian card manufacturing market for the first time in Singapore at KSW¹s
booth no 4G13.

KSW Highlights at Cards Asia:

·Presentation of CEO in Cards Asia Theatre on April 14: KSW Thinlam® - New
Prelaminates for contactless ID Cards
·Thinlam® nominated in Cards Asia Awards
·KSW Microtec welcomes visitors throughout the exhibition on booth number
4G13


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