News
STARCHIP Acquires Contactless Technology through Partnership with CEA-Leti
February 2012 by Marc Jacob
StarChip®, expert in designing and qualifying Smart Card ICs, and CEA-Leti, the leading French semiconductor research institute, have signed an agreement to develop a Contactless Front End for Smart Card applications. The Contactless Front End is the result of Leti’s many years of expertise in Contactless and will enable applications such as Transport, Banking and Identity.
This partnership includes technology and know-how transfer to StarChip® to address all the aspects of the Contactless technologies. Innovative design architecture combined with accurate simulation tools are implemented to ensure the quality, interoperability and security of the Contactless Front End.
The combination of StarChip® expertise in secure IC development, industrialization and certifications with the CEA-Leti’s proven Contactless technology will allow StarChip® to bring to the market state-of-the art and very competitive Smart Card products to address Transport, Banking and Identity markets.
